Fraunhofer USA Center Midwest CMWOverview
Laser welded glass in T-joint configuration
Laser welded glass wafers in different joint configurations
Laser welding of glass has been developed for borosilicate glass using CO2 laser. Due to the crack susceptibility of glass, the process requires careful development. A number of joints such as butt, penetration overlap, T- and fillet edge joints have been successfully achieved. Cross-sections of welded joints show a very smooth transition between the joined glass wafers. Joints have been tested positively for hermetic sealing. Localized welding of glass with high surface quality has been achieved.
Localized laser bonding of glass-to-silicon has been successfully established using low power Nd:YAG and diode lasers. Compared to anodic bonding, no voltage and no area heating are required to facilitate the bonding process.
Advantages
- Localized joining
- High sterile surface quality
- Hermetic sealing
- Non-contact